QUICK TURN PROTOTYPE WIREBOND, FLIP CHIP ATTACH, DIE ATTACH, GLOB TOP, PROTOTYPE, PROCESS DEVELOPMENT
S&C Micro Inc
Wirebond, Flip Chip Attach, Die Attach, Wire Bonding, Quick Turn Prototype
Quick Turn Prototype Wirebond, Die Attach, Flip Chip Attach in San Jose and San Francisco Bay Area. ITAR Registered, US based microelectronics packaging company.